CD4019BMS View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
CD4019BMS Datasheet PDF : 9 Pages
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Typical Applications (Continued)
A1 B1
CD4019BMS
A2 B2
A3 B3
A4 B4
CD4001B
OR EQUIV
CD4001B
OR EQUIV
CD4001B
OR EQUIV
K (•)
CD4001B OR EQUIV
A1 ⊕ B1
CD4001B OR EQUIV
A1 • B1 A2 ⊕ B2
A2 • B2 A3 ⊕ B3
A3 •B3 A4 ⊕ B4
A4 • B4
K (⊕)
CD4019B
OUT1
OUT2
OUT3
FIGURE 12. AND/OR EXCLUSIVE-OR SELECTOR
K(•)
0
1
0
1
TRUTH TABLE
K(⊕)
0
0
1
1
OUT
0
A•B
A⊕B
A+B
Chip Dimensions and Pad Layout
OUT4
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
7-315
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