SAA4978 View Datasheet(PDF) - Philips Electronics

Part Name

Description

MFG CO.

SAA4978

Picture Improved Combined Network (PICNIC)

Philips Electronics 

Philips Semiconductors

Picture Improved Combined Network

(PICNIC)

Product specification

SAA4978H

14.5 Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE

BGA, SQFP

not suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)

PLCC(3), SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended(3)(4)

SSOP, TSSOP, VSO

not recommended(5)

SOLDERING METHOD

REFLOW(1)

suitable

suitable

suitable

suitable

suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

1999 May 03

54

Share Link: