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Description : Toshiba MLC 16K 2CE 19nm 16GB TH58TEG7DDJTA20 C Ver TSOP48 3.3V
Description : SAMSUNG moviNAND
Part Name(s) : H27UAG8T2C
Hynix Semiconductor
Hynix Semiconductor
Description : H27UAG8T2C / NAND Flash
Description : Bluetooth® Module
Description : 10 AMP SUBMINIATURE POWER RELAY
Description : Ultra Low Dropout Voltage Regulator
Description : 16M x 4bit CMOS Dynamic RAM with Extended Data Out
Part Name(s) : K4E660412D K4E640412D
Samsung
Samsung
Description : 16M x 4bit CMOS Dynamic RAM with Extended Data Out (Rev - V2)
Unisonic Technologies
Unisonic Technologies
Description : MICROPOWER DC/DC CONVERTERS WITH LOW-BATTERY DETECTOR ACTIVE IN SHUTDOWN
Adlink Technology Inc.
Adlink Technology Inc.
Description : Extreme Rugged Cold Plate Mount System with Intel® Xeon® Processor and MIL-DTL-38999 Connectors
Description : 1M x 16Bit CMOS Dynamic RAM with Fast Page Mode
Part Name(s) : SM3257
Unspecified
Unspecified
Description : USB2.0 Flash Memory Controller
Part Name(s) : 2701113
Phoenix Contact
Phoenix Contact
Description : Memory - VL 160 GB SSD KIT
Description : IR ReceiVer Modules for Remote Control Systems
Description : IR ReceiVer Modules for Remote Control Systems (Rev - 2005)
Description : Fastest & Securest USB 2.0/USB1.1 Flash Disk Controller with dedicated 32-bit microprocessor
Part Name(s) : TLP2066
Toshiba
Toshiba
Description : TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC (Rev - 2007)
Panasonic Corporation
Panasonic Corporation
Description : microSDHC/microSDXC Memory Card, Consumer Plus MLC Model (Extended Temperature)
Part Name(s) : 2701014
Phoenix Contact
Phoenix Contact
Description : Memory - VL I7 160 GB SSD KIT
Description : 10 Mbps ARCNET (ANSI 878.1) Controller with 2Kx8 On-Chip RAM
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