P/N + Description + Content Search
Part Name(s) : CPD_ EMD2_ EMD3_ EMD4_ EMD5_ GMD2_ HMD12_ HMD8_ LLDS_ LPDS_
ROHM Semiconductor
Description : Packaging specifications
Vishay Semiconductors
Description : Packaging Information
HIROSE ELECTRIC
Description : High-density Packaging System
Part Name(s) : MNA02 MNA028CN105MK
ROHM Semiconductor
Description : (1005 (0402)×2 size, chip capacitor networks)
Part Name(s) : ICM-0805 ICM-1206 ICM-2824 ICM-3528 ICM-4743 IFCB-0402 ILAS-1206 ILB-1206 ILBB-0402 ILBB-0603
Vishay Semiconductors
Description : SMD Magnetics Packaging Methods
Part Name(s) : NCP1450A NCP1500 NCP1500_06 NCP1501 NTLJF117P NTLJF156N NTLJS4159N NTLTS3107P NTZD3151P NCP1510A
ON Semiconductor
Description : Low Profile, Small Footprint Packaging
Part Name(s) : A553-5999-47 S553-5999-87
Bel Fuse Inc.
Description : 10BASE-T NETWORK COMPONENTS
Part Name(s) : CMG-10833 CMG-10834 CMG-10835 CMG-10836 CMG-10837 CMG-10838 CMG-10839 CMG-10840 CMG-10841 CMG-10842
Unspecified
Description : BAGS, ESD SHIELDING, METAL IN, TRANSPARENT, PACKAGED IN MULTICOMP Packaging
Unspecified
Description : MICRO JACKS
Part Name(s) : S553-1084-04
Bel Fuse Inc.
Description : ATM 25.6 MBPS INTERFACE MODULE
Part Name(s) : AN-9040
Fairchild Semiconductor
Description : Assembly Guidelines for Power33 Packaging
Part Name(s) : M513
M/A-COM Technology Solutions, Inc.
Description : Tape and Reel Packaging for Surface Mount Components
Part Name(s) : S558-5999-85
Bel Fuse Inc.
Description : ATM 25.6 MBPS NTERFACE MODULE
Unspecified
Description : MICRO PINS
Part Name(s) : AN-9048
Fairchild Semiconductor
Description : Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging
Part Name(s) : SOT-26
TOREX SEMICONDUCTOR
Description : Packaging Information / Reference Pattern Layout Dimensions