BTA1759M3 View Datasheet(PDF) - Cystech Electonics Corp.
Part Name
Description
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BTA1759M3 Datasheet PDF : 6 Pages
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CYStech Electronics Corp.
SOT-89 Dimension
Spec. No. : C309M3
Issued Date : 2003.06.30
Revised Date : 2018.02.02
Page No. : 6/4
A
123
C
Marking:
Device
Code
H
M94
Date
□□
Code
B
D
E
F
G
Style: Pin 1. Base 2. Collector 3. Emitter
I
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
DIM
Inches
Min. Max.
A 0.1732 0.1811
B 0.1594 0.1673
C 0.0591 0.0663
D 0.0945 0.1024
E 0.01417 0.0201
Millimeters
Min. Max.
4.40 4.60
4.05 4.25
1.50 1.70
2.40 2.60
0.36 0.51
DIM
Inches
Min. Max.
F 0.0583 0.0598
G 0.1165 0.1197
H 0.0551 0.0630
I 0.0138 0.0161
*: Typical
Millimeters
Min. Max.
1.48 1.527
2.96 3.04
1.40 1.60
0.35 0.41
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA1759M3
CYStek Product Specification
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