XM1001-BD
Image Reject Mixer
12.0-40.0 GHz
Mechanical Drawing
1.945
(0.077)
0.831
(0.033)
2
3
1.567
(0.062)
4
0.968
(0.038)
0.364
(0.014)
1
5
0.0
0.0
0.831
1.320
(0.033)
(0.052)
(Note: Engineering designator is 20IRRFM0374)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:1.592 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
Bond Pad #3 (Vg)
Bond Pad #4 (LO)
Bond Pad #5 (IF2)
Bias Arrangement
IF1
2
3
Vg
Bypass Capacitors - See App Note [2]
Rev. V1
4
RF 1
5
IF2
8
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