TGC1430F View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
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TGC1430F Datasheet PDF : 4 Pages
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Product Data Sheet
August 5, 2008
TGC1430F
Recommended Assembly Drawing
RFin
RFout
Attach 2 TFNs and MMIC to carrier plate as
shown using conductive epoxy.
Bond 4 wires as shown using minimum length.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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