CXG1061TN View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

View to exact match

CXG1061TN

Low Noise Down Conversion Mixer for PHS

Sony Semiconductor 

Package Outline Unit : mm

CXG1061TN

10PIN TSSOP(PLASTIC)

∗2.8 ± 0.1

10

6

1.2MAX

0.1

+ 0.15

0.1 – 0.05

1

+ 0.08

0.22 – 0.07

5

0.5

0.1 M

0.25

0° to 10°

A

(0.2)

+ 0.08

0.22 – 0.07

DETAIL A

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

TSSOP-10P-L01

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.02g

—5—

Share Link: