HARDWARE
GROUP EXPANSION
GROUP EXPANSION
Renesas Technology plans to expand the 3850 group (spec. H) as
follows.
Memory Type
Support for mask ROM, One Time PROM, and flash memory ver-
sions.
Memory Size
Flash memory size ......................................................... 32 K bytes
One Time PROM size ..................................................... 24 K bytes
Mask ROM size ................................................... 8 K to 32 K bytes
RAM size ............................................................... 512 to 1 K bytes
Packages
42P4B ......................................... 42-pin shrink plastic-molded DIP
42P2R-A/E ......................................... 42-pin plastic-molded SSOP
42S1B-A .................. 42-pin shrink ceramic DIP (EPROM version)
Memory Expansion Plan
ROM size (bytes)
ROM
exteranal
32K
28K
24K
Mass production
M38507M8/F8
Mass production
M38504M6/E6
20K
Mass production
16K
M38503M4H
12K
Mass production
8K
M38503M2H
As of Aug. 2003
384 512 640 768 896 1024 1152 1280 1408 1536 2048
RAM size (bytes)
Fig. 4 Memory expansion plan
1-6
3850 Group (Spec. H) User’s Manual