datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

M38504M6-FP View Datasheet(PDF) - Renesas Electronics

Part Name
Description
View to exact match
M38504M6-FP
Renesas
Renesas Electronics Renesas
M38504M6-FP Datasheet PDF : 287 Pages
First Prev 21 22 23 24 25 26 27 28 29 30 Next Last
HARDWARE
GROUP EXPANSION
GROUP EXPANSION
Renesas Technology plans to expand the 3850 group (spec. H) as
follows.
Memory Type
Support for mask ROM, One Time PROM, and flash memory ver-
sions.
Memory Size
Flash memory size ......................................................... 32 K bytes
One Time PROM size ..................................................... 24 K bytes
Mask ROM size ................................................... 8 K to 32 K bytes
RAM size ............................................................... 512 to 1 K bytes
Packages
42P4B ......................................... 42-pin shrink plastic-molded DIP
42P2R-A/E ......................................... 42-pin plastic-molded SSOP
42S1B-A .................. 42-pin shrink ceramic DIP (EPROM version)
Memory Expansion Plan
ROM size (bytes)
ROM
exteranal
32K
28K
24K
Mass production
M38507M8/F8
Mass production
M38504M6/E6
20K
Mass production
16K
M38503M4H
12K
Mass production
8K
M38503M2H
As of Aug. 2003
384 512 640 768 896 1024 1152 1280 1408 1536 2048
RAM size (bytes)
Fig. 4 Memory expansion plan
1-6
3850 Group (Spec. H) User’s Manual

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]