LLL317R71H103MD01K View Datasheet(PDF) - Unspecified

Part Name

Description

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LLL317R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Continued from the preceding page.

<Applicable to GMA or GMD Series>

9. Die Bonding/Wire Bonding

1. Die Bonding of Capacitors

1-1. Use the following materials for the Brazing alloys:

Au-Sn (80/20) 300 to 320 °C in N2 atmosphere

1-2. Mounting

(1) Control the temperature of the substrate so it

matches the temperature of the brazing alloy.

(2) Place the brazing alloy on the substrate and place

the capacitor on the alloy. Hold the capacitor and

gently apply the load. Be sure to complete the

operation within 1 minute.

2. Wire Bonding

2-1. Wire

Gold wire: 25 micro m (0.001 inch) diameter

2-2. Bonding

(1) Thermo compression, ultrasonic ball bonding.

(2) Required stage temperature: 150 to 200 °C

(3) Required wedge or capillary weight: 0.2N to 0.5N

(4) Bond the capacitor and base substrate or other

devices with gold wire.

C02E.pdf

Nov.27,2017

Other

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands

during operation in order to avoid the danger of an

electric shock.

1-2. Do not allow the terminals of a capacitor to come in

contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid,

including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will

operate is under the specified conditions.

Do not use the equipment under the following

environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or

radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide,

sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the

specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any

conditions that can cause condensation.

Continued on the following page.

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