MC74VHC1G00 View Datasheet(PDF) - ON Semiconductor
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Description
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MC74VHC1G00 Datasheet PDF : 6 Pages
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MC74VHC1G00
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Sink Current
ICC
DC Supply Current per Supply Pin
TSTG
TL
TJ
qJA
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70−5/SC−88A (Note 1)
TSOP−5
Value
*0.5 to +7.0
−0.5 to +7.0
*0.5 to VCC +0.5
−20
$20
$12.5
$25
*65 to +150
260
+150
350
230
Unit
V
V
V
mA
mA
mA
mA
°C
°C
°C
°C/W
PD
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A
150
mW
TSOP−5
200
MSL
Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
ILATCHUP Latchup Performance
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
DC Supply Voltage
VIN
DC Input Voltage
VOUT
DC Output Voltage
TA
Operating Temperature Range
tr , tf
Input Rise and Fall Time
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
Min
2.0
0.0
0.0
*55
0
0
Max
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
2
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