CS8191XDWF20 View Datasheet(PDF) - ON Semiconductor
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CS8191XDWF20 Datasheet PDF : 12 Pages
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–A–
16
1
H
G
CS8191
PACKAGE DIMENSIONS
DIP–16
NF SUFFIX
CASE 648–08
ISSUE R
9
B
8
F
C
L
S
–T–
SEATING
PLANE
K
J
M
D 16 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M
0_ 10_ 0 _ 10 _
S 0.020 0.040 0.51 1.01
SO–20L
DWF SUFFIX
CASE 751D–05
ISSUE F
D
A
q
20
11
E
1
10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
PACKAGE THERMAL DATA
Parameter
RΘJC
RΘJA
Typical
Typical
DIP–16
15
50
SO–20L
9
55
Unit
°C/W
°C/W
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11
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