Multilayer Ceramic Chip Capacitors
CGJ3E2X7R1E153K080AA
Associated Images
Land Pattern (Terminal Connection)
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Creation Date : December 07, 2017 (GMT)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciļ¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.