25X40BLSIG View Datasheet(PDF) - Winbond

Part Name

Description

View to exact match

25X40BLSIG

1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

Winbond 

W25X10BL/20BL/40BL

11. PACKAGE SPECIFICATION

11.1 8-Pin SOIC 150-mil (Package Code SN)

1

SYMBOL

A

A1

b

c

E(3)

D(3)

e(2)

HE

Y(4)

L

θ

MILLIMETERS

Min

1.35

0.10

0.33

0.19

3.80

4.80

5.80

-

0.40

0°

1.27 BSC

Max

1.75

0.25

0.51

0.25

4.00

5.00

6.20

0.10

1.27

10°

INCHES

Min

Max

0.053

0.069

0.004

0.010

0.013

0.020

0.008

0.010

0.150

0.157

0.188

0.196

0.050 BSC

0.228

-

0.016

0°

0.244

0.004

0.050

10°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

- 46 -

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