UPC8158K View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
View to exact match
UPC8158K
NEC => Renesas Technology
UPC8158K Datasheet PDF : 12 Pages
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µPC8158K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
µPC8158K
Soldering Method
Soldering Conditions
Infrared Reflow
Partial Heating
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 2, Exposure limitNote: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition
Symbol
IR35-00-2
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P13831EJ1V1DS00
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