SST89E54RD2A View Datasheet(PDF) - Silicon Storage Technology

Part Name

Description

View to exact match

SST89E54RD2A

FlashFlex MCU

Silicon Storage Technology 

FlashFlex MCU

SST89E54RD2A/RDA / SST89E58RD2A/RDA

SST89V54RD2A/RDA / SST89V58RD2A/RDA

Data Sheet

Pin #1 Identifier 44

1

34

33

10.00 ± 0.10

12.00 ± 0.25

.30

.45

.80 BSC

11

23

1.2

max.

12

22

10.00 ± 0.10

12.00 ± 0.25

.09

.20

.95

1.05

.05

.15

Note:

1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (min/max).

3. Coplanarity: 0.1 (±0.05) mm.

4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.

FIGURE 16-3: 44-Lead Thin Quad Flat Pack (TQFP)

SST Package Code: TQJ

.45

0˚- 7˚

.75

1.00 ref

44-tqfp-TQJ-7

1mm

Pin #1

TOP VIEW

SIDE VIEW

0.2

BOTTOM VIEW

See notes

2 and 3

Pin #1

6.00 ± 0.10

0.075

4.1

4.1

0.5 BSC

0.30

0.18

0.45

6.00 ± 0.10

0.05 Max

0.35

0.80

0.70

Note: 1. Complies with JEDEC JEP95 MO-220I, variant WJJD-5 except external paddle nominal dimensions.

2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

1mm

3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads.

This paddle should be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit.

40-wqfn-6x6-QI-1

Connection of this paddle to any other voltage potential will result in shorts and/or electrical malfunction of the device.

4. Untoleranced dimensions are nominal target dimensions.

5. All linear dimensions are in millimeters (max/min).

FIGURE 16-4: 40-contact Very-Very-Thin Quad Flat No-Lead (WQFN)

SST Package Code: QI

©2007 Silicon Storage Technology, Inc.

83

S71339-01-000

1/07

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