datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

MLX16305(2006) View Datasheet(PDF) - Melexis Microelectronic Systems

Part Name
Description
View to exact match
MLX16305
(Rev.:2006)
Melexis
Melexis Microelectronic Systems  Melexis
MLX16305 Datasheet PDF : 29 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MLX16305
Interlock switch sensor interface IC
TABLE OF CONTENTS
FEATURES AND BENEFITS ....................................................................................................................... 1
APPLICATIONS............................................................................................................................................ 1
ORDERING INFORMATION......................................................................................................................... 1
1. OVERVIEW APPLICATION SCHEMATIC......................................................................................... 1-2
2. DESCRIPTION.................................................................................................................................... 2-2
3. ABSOLUTE MAXIMUM RATINGS ....................................................................................................... 4
4. MLX16305 ELECTRICAL SPECIFICATIONS ...................................................................................... 4
5. PIN ASSIGNMENT ................................................................................................................................ 5
6. BLOCK DIAGRAM ................................................................................................................................ 6
7. GENERAL DESCRIPTION .................................................................................................................... 7
8. PIN DESCRIPTION................................................................................................................................ 7
8.1. SUPPLY RANGE (VSUP).................................................................................................................................7
8.2. INPUT VOLTAGE REFERENCE (VREF)............................................................................................................7
8.3. VOLTAGE REGULATION (SENSE)..................................................................................................................8
8.4. OUTPUT VOLTAGE TO THE MICROCONTROLLER ADC (MEAS_OUT)............................................................8
8.5. DIGITAL INPUTS .............................................................................................................................................9
8.6. ENCODER: INTERNAL DIGITAL SIGNALS ...................................................................................................10
9. VOLTAGE MODE (VM) ....................................................................................................................... 13
10. CURRENT MODE (CM)....................................................................................................................... 14
10.1. CURRENT TO VOLTAGE CONVERSION PRINCIPLE..........................................................................................14
10.2. THE ACTUAL MEASUREMENT .......................................................................................................................14
10.3. HOW TO DO AN OFFSET CURRENT MEASUREMENT ........................................................................................15
10.4. MEASUREMENT ERRORS ..............................................................................................................................16
11. HOW TO PREDICT THE SYSTEM OPERATING ZONE.................................................................... 17
11.1. VMEASOUT LIMITS.....................................................................................................................................17
11.2. ISENSE LIMITS .............................................................................................................................................17
12. OVERCURRENT LIMITATION............................................................................................................ 18
13. OVERTEMPERATURE DETECTION.................................................................................................. 19
13.1. OVERTEMPERATURE CONSIDERATIONS ........................................................................................................20
14. DIAGNOSTICS .................................................................................................................................... 21
14.1. SHORTS ........................................................................................................................................................21
14.2. OPEN WIRE ..................................................................................................................................................21
14.3. DIAGNOSTICS FLOW .....................................................................................................................................22
15. MULTIPLEXING THE ADC INPUT BY SETTING MEAS_OUT HIGH IMPEDANT............................ 23
16. APPLICATION NOTES ....................................................................................................................... 24
16.1. SYSTEM DEFINITION EXAMPLE WITH 2-WIRE HALL SWITCHES .....................................................................24
16.2. RESISTIVE SWITCHES ...................................................................................................................................25
16.3. 2-WIRE ANALOG SENSORS ............................................................................................................................25
16.4. GROUND SHIFT ............................................................................................................................................26
17. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 27
18. ESD PRECAUTIONS........................................................................................................................... 27
19. PACKAGE INFORMATION................................................................................................................. 28
20. DISCLAIMER ....................................................................................................................................... 29
3901016305
Rev. 005
Page 3 of 29
Data Sheet
Oct/06

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]