LP61L1024 View Datasheet(PDF) - AMIC Technology

Part Name

Description

View to exact match

LP61L1024

128K X 8 BIT 3.3V HIGH SPEED LOW VCC CMOS SRAM

AMIC Technology 

Package Information

36LD CSP (6 x 8 mm) Outline Dimensions

TOP VIEW

Ball*A1 CORNER

123456

A

B

C

D

E

F

G

H

SIDE VIEW

LP61L1024

unit: mm

BOTTOM VIEW

Ball#A1 CORNER

0.10 S C

0.25 S C A B

b (36X)

654321

A

B

C

D

E

F

G

H

B

e

D1

A

D

0.20(4X)

C SEATING PLANE

Symbol

A

A1

A2

D

E

D1

E1

e

b

Dimensions in mm

MIN. NOM. MAX.

1.00 1.10 1.20

0.16 0.21 0.26

0.48 0.53 0.58

5.80 6.00 6.20

7.80 8.00 8.20

--- 3.75 ---

--- 5.25 ---

--- 0.75 ---

0.25 0.30 0.35

Note:

1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS

ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).

2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS

OF THE SOLDER BALLS.

3. DIMENSION b IS MEASURED AT THE MAXIMUM.

4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE

SOLDER BALL AND THE BODY EDGE.

(August, 2004, Version 2.2)

13

AMIC Technology, Corp.

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