LIS2L02AL View Datasheet(PDF) - STMicroelectronics

Part Name

Description

View to exact match

LIS2L02AL

MEMS INERTIAL SENSOR: 2-axis - +/-2g ultracompact linear accelerometer

STMicroelectronics 

LIS2L02AL

6

Package Information

Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 15. LGA-8 Mechanical Data & Package Dimensions

DIM.

A1

A2

A3

D1

E1

L

L1

M

M1

N

N1

N2

P1

P2

T1

T2

R

h

k

j

mm

inch

MIN. TYP. MAX. MIN. TYP. MAX.

1.460 1.520 1.600 0.0574 0.0598 0.0629

1.330

0.0523

0.180 0.220 0.260 0.007 0.0086 0.0102

4.850 5.000 5.150 0.190 0.1968 0.2027

4.850 5.000 5.150 0.190 0.1968 0.2027

1.270

0.05

2.540

0.1

1.225

0.0482

0.875 0.900 0.925 0.0344 0.0354 0.0364

2.000

0.0787

1.225

0.0482

1.170

0.046

1.300 1.350 1.400 0.0511 0.0531 0.0551

0.740 0.790 0.840 0.0291 0.0311 0.033

1.170

0.046

0.615 0.640 0.665 0.0242 0.0251 0.0261

1.200

1.600 0.0472

0.0629

0.150

0.0059

0.050

0.0019

0.100

0.0039

OUTLINE AND

MECHANICAL DATA

LGA8 (5x5x1.6mm)

Land Grid Array Package

E1

A

K

(4x)

D

KE

A3

KC

R

E

M M1

T1

8

7

1

D

6

2

5

3

4

B

E

P1

DETAIL A

A2

A1

h CA B

seating plane

K

Detail A

SOLDER MASK

OPENING

METAL PAD

j CAB

7669231 C

15/17

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