HI3-0506-5 View Datasheet(PDF) - Intersil
Part Name
Description
View to exact match
HI3-0506-5 Datasheet PDF : 23 Pages
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HI-506, HI-507, HI-508, HI-509
Absolute Maximum Ratings
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44V
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +22V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V
Digital Input Voltage (VEN, VA) . . . . . (V-) -4V to (V+) +4V or 20mA,
Whichever Occurs First
Analog Signal (VIN, VOUT, Note 2) . . . . . . . . . . (V-) -2V to (V+) +2V
Continuous Current, In or Out . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Peak Current, In or Out (Pulsed 1ms, 10% Duty Cycle Max) . 40mA
Operating Conditions
Temperature Ranges
HI-506/507/508/509-2 . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
HI-506/508/509-4 . . . . . . . . . . . . . . . . . . . . . . . . . . -25oC to 85oC
HI-506/507/508/509-5 . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC
HI-506/508-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (oC/W) θJC (oC/W)
16 Ld CERDIP Package. . . . . . . . . . . .
85
32
16 Ld SOIC Package . . . . . . . . . . . . . . 115
N/A
16 Ld PDIP Package . . . . . . . . . . . . . . 100
N/A
20 Ld PLCC Package. . . . . . . . . . . . . .
80
N/A
28 Ld CERDIP Package. . . . . . . . . . . .
55
18
28 Ld PDIP Package . . . . . . . . . . . . . .
60
N/A
28 Ld SOIC Package . . . . . . . . . . . . . .
70
N/A
28 Ld PLCC Package. . . . . . . . . . . . . .
70
N/A
Maximum Junction Temperature
Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175oC
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC and PLCC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
2. Signals on IN or OUT exceeding V+ or V- are clamped by internal diodes. Limit resulting current to maximum current ratings. If an overvoltage
condition is anticipated (analog input exceeds either power supply voltage), the Harris HI-546/HI-547/HI-548/HI-549 multiplexers are
recommended.
Electrical Specifications Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V; VAL (Logic Level Low) = 0.8V,
Unless Otherwise Specified. For Test Conditions, Consult Test Circuits Section
PARAMETER
-2
-4, -5, -9
TEST
TEMP
CONDITIONS (oC)
MIN
TYP MAX
MIN
TYP MAX
DYNAMIC CHARACTERISTICS
Access Time, tA
25
-
250
500
-
250
-
Full
-
-
1000
-
-
1000
Break-Before-Make Delay, tOPEN
Enable Delay (ON), tON(EN)
25
25
80
-
25
80
-
25
-
250
500
-
250
-
Full
-
-
1000
-
-
1000
Enable Delay (OFF), tOFF(EN)
25
-
250
500
-
250
-
Full
-
-
1000
-
-
1000
Settling Time, tS
(HI-506 and HI-507)
To 0.1%
To 0.01%
25
-
1.2
-
-
1.2
-
25
-
2.4
-
-
2.4
-
Settling Time, tS
(HI-508 and HI-509)
To 0.1%
To 0.01%
25
-
360
-
-
360
-
25
-
600
-
-
600
-
Off Isolation
Note 6
25
50
68
-
50
68
-
Channel Input Capacitance, CS(OFF)
Channel Output Capacitance, CD(OFF)
HI-506
25
-
10
-
-
10
-
25
-
52
-
-
52
-
HI-507
25
-
30
-
-
30
-
HI-508
25
-
17
-
-
17
-
HI-509
25
-
12
-
-
12
-
Digital Input Capacitance, CA
Input to Output Capacitance, CDS(OFF)
25
-
6
-
-
6
-
25
-
0.08
-
-
0.08
-
UNITS
ns
ns
ns
ns
ns
ns
ns
µs
µs
ns
ns
dB
pF
pF
pF
pF
pF
pF
pF
7
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