DF30FC-24DS-0.4V(82) View Datasheet(PDF) - HIROSE ELECTRIC

Part Name

Description

View to exact match

DF30FC-24DS-0.4V(82)

0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC 

BUsage Recommendations

1. Recommended temperature profile

(Temperature)

250ç

200ç

Reflow Conditions

Preheating: 150ç to 170ç 60 to 120 sec.

Soldering: 245±5ç 10 sec. max.

220ç

60 sec. max.

150ç

100ç

50ç

60 to 120 sec.

10 sec. max

250ç max.

220ç

60 sec. max.

2. Recommended manual soldering

3. Recommended screen thickness and

open area ratio (Pattern area ratio)

4.Board warpage

5.Cleaning conditions

6. Precautions

0ç

0 sec.

50 sec.

100 sec.

150 sec. (Time)

Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is

a return to normal temperature between the first and second cycle.

Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the

connector terminals.

Manual soldering: 290±10ç for 3 seconds

Thickness: 0.12 mm

Opening are ratio: DS side 100%, DP side 84%

Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points.

Refer to "Nylon Connector Use Handbook".

s Due to the extremely small size of the connectors, handling it with bare hands should

be avoided. Follow the recommendations given on the proceeding pages.

s Use of fluxes is NOT recommended.

s Different production lots may exhibit some discoloration of the insulator material. This

will not affect form, fit or function of the connectors.

s The connectors should not be used a sole PCB support. It is recommended to use

additional means of board support.

9

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