AP105-DF20-2830S View Datasheet(PDF) - HIROSE ELECTRIC
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Description
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AP105-DF20-2830S Datasheet PDF : 7 Pages
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BUsage recommendation
1. Recommended Soldering
Temperature Profile for IR Reflow.
Temperature
IR Reflow
Preheating: 150°C for 60 sec. to 120 sec.
Soldering: 235°C±5°C for 10 sec. max.
... Maximum 240°C 220°C min.
10s to 30s ... 220°C
Maximum 240°C
220°C
Preheating
Soldering
Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided
that there is a return to normal temperature between the first and second cycle.
Note 2: The temperature indicates the board surface temperature at the points of contacts
with the connector terminals.
2.Recommended Manual Soldering Conditions Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.
3. Recommended Solder Screen Thickness 0.15mm
4. Board Warping
Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
5. Cleaning Conditions
Refer to "Nylon Connector Use Handbook."
6. Wiring Termination Conditions
Refer to "Nylon Connector Use Handbook."
Crimp contacts should be handled with care as not to cause any deformation or damage
affecting the performance or termination.
7. Mating / un-mating precautions Excessive twisting and pulling on wires during mating/un-mating should be avoided as it
may cause damage to connectors.
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