DF13 View Datasheet(PDF) - HIROSE ELECTRIC
Part Name
Description
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DF13 Datasheet PDF : 11 Pages
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BPrecautions
1. Recommended Temperature
Profile (SMT)
2. Recommended Soldering
Condition (SMT)
3. Recommended Screen
Thickness (SMT)
4. Board Warpage (SMT)
5. Recommended Soldering
5. Condition (Through hole)
6. Cleaning Condition
7. Connection Condition
8. Cautions
Note 1.This process is allowed up to twice under the same condition.
However, the interval between the first and second processes must be maintained at
the room temperature.
Note 2.The temperature indicates the board surface temperature in the connector lead area.
Manual soldering: 290ç for 2 seconds
0.15 to 0.2mm
Max 0.03mm in the connector center area, based on both connector edges
Flow: 250ç for 3 seconds
Manual soldering: 290ç for 2 seconds
Refer to Nylon Connector Use Hand book.
Refer to Nylon Connector Use Hand book.
sCarefully carry out the crimping operation according to "Crimping Condition Sheet" and
"Crimping Quality Standard", because the crimping contact is an extremely small style.
sBe careful for the excessive scoop insertion/extraction, which will cause damage to the
product.
B193
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