PI3B3244LE View Datasheet(PDF) - Pericom Semiconductor
Part Name
Description
View to exact match
PI3B3244LE Datasheet PDF : 5 Pages
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PI3B3244
3.3V, Hot Insertion
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Packaging Mechanical: 20-Pin QSOP (Q)
20
1
.337 8.56
.344 8.74
.150 3.81
.157 3.99
Guage Plane
.010
0.254
Detail A
.008
0.20
MIN.
.008
.013
0.20
0.33
0˚-6˚
.016
.035
0.41
0.89
.041
1.04
REF
.058 REF
1.47
.053 1.35
.069 1.75
SEATING
PLANE
.025
BSC
0.635
.008 0.203
.012 0.305
.004 0.101
.010 0.254
X.XX DENOTES DIMENSIONS
X.XX IN MILLIMETERS
.015 x 45˚
0.38
Detail A
.016 0.41
.050 1.27
.228
.244
5.79
6.19
.007 0.178
.010 0.254
Packaging Mechanical: 20-Pin TSSOP (L)
20
.169 4.3
.177 4.5
1
.252
.260
6.4
6.6
.0256
BSC
0.65
.007
.012
0.19
0.30
.047
1.20
Max
SEATING
PLANE
.002 0.05
.006 0.15
0.45 .018
0.75 .030
.238
.269
6.1
6.7
X.XX DENOTES CONTROLLING
X.XX DIMENSIONS IN MILLIMETERS
.004 0.09
.008 0.20
Pericom Semiconductor Corporation • 1-800-435-2336 • www.pericom.com
4
PS8149F 08/25/04
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