ADN2816
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
25
32
24
1
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
17
8
0.50
16
9
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model1
ADN2816ACPZ
ADN2816ACPZ-500RL7
ADN2816ACPZ-RL7
EVAL-ADN2816EBZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ, 7”Tape-Reel, 500 pieces
32-Lead LFCSP_WQ, 7”Tape-Reel, 1,500 pieces
Evaluation Board
Package Option
CP-32-7
CP-32-7
CP-32-7
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
© 2005–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04948-0-2/12(C)
Rev. C | Page 24 of 24