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IRKD320- View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
View to exact match
IRKD320- Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
VS-VSK.250PbF, VS-VSK.270PbF, VS-VSK.320PbF Series
www.vishay.com
Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction operating and
storage temperature range
Maximum thermal resistance,
junction to case per junction
Maximum resistance, case to heat sink
per module
Mounting
torque
± 10 %
MAGN-A-PAK to heatsink
busbar to MAGN-A-PAK
TJ, TStg
RthJC
RthCS
DC operation
Mounting surface flat, smooth and
greased
A mounting compound is recommended
and the torque should be rechecked
after a period of about 3 hours to allow
for the spread of the compound.
Approximate weight
Case style
VALUES
UNITS
VSK.250 VSK.270 VSK.320
-40 to +150
°C
0.16
0.125
K/W
0.035
4 to 6
Nm
8 to 10
800
g
30
oz.
MAGN-A-PAK
ΔR CONDUCTION PER JUNCTION
DEVICE
180°
SINUSOIDAL CONDUCTION
AT TJ MAXIMUM
120°
90°
60°
VSK.250
0.009 0.010 0.014 0.020
VSK.270
0.008 0.012 0.014 0.020
VSK.320
0.008 0.010 0.013 0.020
30°
0.032
0.032
0.032
180°
0.007
0.007
0.007
RECTANGULAR CONDUCTION
AT TJ MAXIMUM
120°
90°
60°
0.011 0.015 0.021
0.011 0.015 0.020
0.011 0.015 0.020
30°
0.033
0.033
0.033
Note
• The table above shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC
UNITS
K/W
Revision: 27-Apr-17
3
Document Number: 93581
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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