DIM200MHS17-A000
THERMAL AND MECHANICAL RATINGS
Internal insulation material: Al2O3
Baseplate material:
Cu
Creepage distance:
20mm
Clearance:
8mm
CTI (Critical Tracking Index): 175
Symbol
Parameter
R
th(j-c)
Thermal resistance - transistor (per arm)
R
th(j-c)
Thermal resistance - diode (per arm)
Rth(c-h)
T
j
Thermal resistance - case to heatsink
(per module)
Junction temperature
Tstg
Storage temperature range
-
Screw torque
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M6
Min. Typ. Max. Units
-
-
84 ˚C/kW
-
-
176 ˚C/kW
-
-
15 ˚C/kW
-
-
150 ˚C
-
-
125 ˚C
–40
-
125 ˚C
-
-
5
Nm
-
-
5
Nm
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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