12055-102 View Datasheet(PDF) - AMI Semiconductor
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12055-102 Datasheet PDF : 8 Pages
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AMERICAN MICROSYSTEMS, INC.
FS612510-01/-02
1:10 Zero-Delay Clock Buffer IC
November 2000
6.0 Package Information
Table 8: 24-pin TSSOP Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN. MAX. MIN. MAX.
A
-
0.047
A1 0.002 0.006
A2 0.0315 0.0413
b 0.0075 0.0118
C 0.0035 0.0079
D 0.303 0.311
E1 0.169 0.177
E
0.252
e
0.0256
L 0.0177 0.0295
S 0.0079
-
θ1
0°
8°
θ2
12 REF
θ3
12 REF
-
1.20
0.05 0.15
0.80 1.05
0.19 0.30
0.09 0.20
7.70 7.90
4.30 4.50
6.40 BSC
0.65 BSC
0.45 0.75
0.20
-
0°
8°
12 REF
12 REF
24
E1 E
AMERICAN MICROSYSTEMS, INC.
1
b
e
D
BASE PLANE
A2 A
S
c
L
A1
SEATING PLANE
θ2
θ3
θ1
Table 9: 24-pin TSSOP Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
ΘJA
L11
L12
L13
C11
C12
C13
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Longest lead
Longest lead to any 1st adjacent lead
Longest lead to any 2nd adjacent lead
Longest lead to VSS
Longest lead to any 1st adjacent lead
Longest lead to any 2nd adjacent lead
TYP.
84
1.7
0.6
0.24
0.3
0.1
0.007
UNITS
°C/W
nH
nH
pF
pF
ISO9001
QS9000
7
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