E818AHF View Datasheet(PDF) - Semtech Corporation

Part Name

Description

View to exact match

E818AHF

Octal 18V Pin Electronics Driver/window Comparator

Semtech Corporation 

Edge818

TEST AND MEASUREMENT PRODUCTS

Package Information (continued)

e/2

–A, B, D– 3

DETAIL "A"

BASE

PLANE

0.40 MIN.

˚0 MIN.

A2 – 0.10 S

0.13

R. MIN.

0.13 / 0.30 R. TYP.

C

GAGE

PLANE

A1

SEATING

PLANE

L

1.60 REF.

C

0.25

DETAIL "B"

˚ 0 – 7

1.28 REF.

˚ 12 – 16

SEE DETAIL "B"

˚ 12 – 16

A

–H– 2

0.076

–C–

12 0.13 / 0.23

SECTION C–C

8

B

ccc M C A – B S D S

WITH LEAD FINISH

0.13 / 0.17

B

1

BASE METAL

Notes:

1. All dimensions and tolerances conform to ANSI Y14.5-1982.

2. Datum plane -H- located at mold parting line and coincident

with lead, where lead exits plastic body at bottom of parting

line.

3. Datums A-B and -D- to be determined where centerline between

leads exits plastic body at datum plane -H-.

4. To be determined at seating plane -C-.

5. Dimensions D1 and E1 do not include mold protrusion.

Allowable mold protrusion is 0.254 mm per side. Dimensions

D1 and E1 do include mold mismatch and are determined at

datum plane -H-.

6. “N” is the total # of terminals.

7. Package top dimensions are smaller than bottom dimensions

and top of package will not overhang bottom of package.

8. Dimension B does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08 mm total in excess of the

dimension at maximum material condition. Dambar cannot

be located on the lowerradius or the foot.

9. All dimensions are in millimeters.

10. Maximum allowable die thickness to be assembled in this

package family is 0.635 millimeters.

11. This drawing conforms to JEDEC registered outlines MS-108

and MS-022.

12. These dimensions apply to the flat section of the lead between

0.10 mm and 0.25 mm from the lead tip.

Variations

(all dimensions in millimeters)

Symbol

A

A1

A2

D

D1

D2

ZD

E

E1

E2

ZE

L

N

e

B

B1

ccc

ND

NE

Min

0.25

2.57

0.73

0.22

0.22

Nom

3.04

0.33

2.71

23.20 BSC

20.00 BSC

18.85 REF

0.58 REF

17.20

14.00 BSC

12.35 REF

0.83 REF

0.88

100

0.65 BSC

0.30

0.13

30

20

Max

3.40

2.87

1.03

0.38

0.33

Note Comments

Height above PCB

Gap above PCB

Body Thickness

4

5 Body Dimension

4

5 Body Dimension

6 Pin Count

Lead Pitch

8 Pad Dimension

Pad Dimension

Side Pin Count

Side Pin Count

 2004 Semtech Corp. / Rev. 5, 8/18/04

11

www .semtech.com

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