SPM0408HE5H‐SB
11. SOLDER REFLOW PROFILE
170–180°C
230°C
Pre‐heat
120 sec.
Solder Melt
100 sec.
260°C
Stage
Pre‐heat
Solder Melt
Peak
Temperature Profile
170 ~ 180 C
Above 230 C
260 C maximum
Time (maximum)
120 sec.
100 sec.
30 sec.
Notes:
1.
2.
3.
Do not pull a vacuum over the port hole of the microphone. Pulling a
vacuum over the port hole can damage the device.
Do not board wash after the reflow process. Board washing and cleaning
agents can damage the device. Do not expose to ultrasonic processing or
cleaning.
Number of Reflow = recommend no more than 3 cycles.
12. ADDITIONAL NOTES
(A) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD
moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.
(B) MSL (moisture sensitivity level) Class 2a.
Knowles Acoustics, a division of Knowles Electronics,
LLC.
Revision: B
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