XE5692H-ITR View Datasheet(PDF) - Xecom

Part Name

Description

View to exact match

XE5692H-ITR

Half-Size, Low-Cost Global Embedded Modem

Xecom 

XE5692H Surface-Mount Soldering Instructions

The XE5692H is subject to damage if over-exposed to heat during solder reflow operations. Following

the soldering instructions below will ensure that the process of soldering the module to the board does not

damage the modem.

Maximum Temperature

Maximum Time at 220O C

Maximum Time above Eutectic (180O C)

Maximum Preheat Dwell Time

220O C

20 Seconds

90 Seconds

180 Seconds

Maximum Recommended Solder Temperature Profile

220O C

180O C

150O C

------------------------------180 sec max-------------------------

-20 sec-

max

----- 90 sec max -----

XECOM

(7)

XE5692H

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