ST7529 View Datasheet(PDF) - Sitronix Technology Co., Ltd.
Part Name
Description
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ST7529 Datasheet PDF : 86 Pages
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ST7529
3. Pad Arrangement
Chip Size :
16.550mm x 1.525mm
Pad pitch :
Com, Seg pad pitch: 43µm
IO pad pitch: 110µm
Test pin pad pitch: 75µm
Pad size :
Com, Seg pad size:
Pad No1~362 : 25µm (X) x 96µm (Y)
Pad No363~390 : 96µm (X) x 25µm (Y)
Pad No544~571 : 96µm (X) x 25µm (Y)
IO pad pad size: 90µm (X) x 40µm (Y)
Test pin pad size: 55µm (X) x 40µm (Y)
Bump Height: 17µm
Chip Thickness: 635µm
Ver 1.8
2/86
2007/10/25
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