NCV8665
where
RqJC is the junction−to−case thermal resistance,
RqCS is the case−to−heatsink thermal resistance,
RqSA is the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heatsink data sheets
of heatsink manufacturers.
Thermal, mounting, and heatsinking considerations are
discussed in the ON Semiconductor application note
AN1040/D.
160
1000
140
120
SOIC−8 1 oz
100
100
SOIC−8 2 oz
10
80
SOIC−8
D2PAK
60
40 D2PAK 1 oz
D2PAK 2 oz
20
0 100 200 300 400 500 600 700 800 900
COPPER AREA (mm2)
Figure 13. Thermal Resistance vs. PCB Area
1
Single Pulse
0.1
0.000001 0.0001
0.01
1
100
PULSE TIME (sec)
Figure 14. NCV8675 @ PCB Cu Area 100 mm2
PCB Cu thk 1 oz
ORDERING INFORMATION
Device
Package
Shipping†
NCV8665DS50G
D2PAK
(Pb−Free)
50 Units / Rail
NCV8665DS50R4G
D2PAK
(Pb−Free)
800 / Tape & Reel
NCV8665D50G
SOIC−8
(Pb−Free)
98 Units / Rail
NCV8665D50R2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
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