7411(2017) View Datasheet(PDF) - Analog Devices

Part Name

Description

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7411
(Rev.:2017)

SPI-/I2C-Compatible, 10-Bit Digital Temperature Sensor and 8-Channel ADC

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VDD to GND

Analog Input Voltage to GND

Digital Input Voltage to GND

Operating Temperature Range

Storage Temperature Range

Junction Temperature

16-Lead QSOP

Power Dissipation1

Thermal Impedance2

−0.3 V to +7 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−40°C to +120°C

−65°C to +150°C

150°C

(TJmax − TA)/θJA

θJA Junction-to-Ambient

θJC Junction-to-Case

IR Reflow Soldering

Peak Temperature

Time at Peak Temperature

Ramp-Up Rate

Ramp-Down Rate

105.44°C/W

38.8°C/W

220°C (0°C/5°C)

10 sec to 20 sec

2°C/sec to 3°C/sec

−6°C/sec

IR Reflow Soldering (Pb-Free Package)

Peak Temperature

Time at Peak Temperature

Ramp-Up Rate

Ramp-Down Rate

Time 25°C to Peak Temperature

260°C (+0°C)

20 sec to 40 sec

3°C/sec maximum

−6°C/sec maximum

8 minutes maximum

1 Values relate to package being used on a 4-layer board.

2 Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled PCB-

mounted components.

ADT7411

Table 3. I2C Address Selection

ADD Pin

I2C Address

Low

1001 000

Float

1001 010

High

1001 011

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ESD CAUTION

Rev. C | Page 7 of 36

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