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Description
5962F9562601QXC View Datasheet(PDF) - Intersil
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Description
View to exact match
5962F9562601QXC
Radiation Hardened 8kx8 CMOS PROM
Intersil
5962F9562601QXC Datasheet PDF : 5 Pages
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Die Characteristics
DIE DIMENSIONS:
271milsx307milsx19mils
±
1mils
INTERFACE MATERIALS:
Glassivation:
Type: SiO
2
Thickness: 8k
Å
±
1k
Å
Top Metallization:
M1:6k
Å
±
±
1k
Å
Si/Al/Cu
2k
Å
±
±
500
Å
TiW
M2:10k
Å
±
2k
Å
Si/Al/Cu
Metallization Mask Layout
HS-6664RH
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
V
DD
ADDITIONAL INFORMATION:
Worst Case Current Density:
2x10
5
A/cm
2
Transistor Count:
110, 874
HS-6664RH
4
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